Playbook teardown calls TI a winner
Rick Merritt
Texas Instruments was one of the big winners in the Research in Motion Playbook, according to a teardown conducted by UBM TechInsights. TI won sockets for its Omap 4430 processor, a four-in-one combo connectivity chip and power management and converter chips in the new mobile system.
The Playbook is the first system torn down by UBM TechInsights to use the new TI connectivity chip. Choosing the new device for the handset maker's first tablet was "a daring decision," said one analyst.
In addition, RIM appears to have stayed close to the TI Omap 4430 platform with its selection of the TI TWL6040 power management IC and the TI PS63020 high efficiency single inductor buck-boost converter, said Allan Yogasingam, a technical marketing manager with UBM TechInsights, a division of United Business media, the publisher of EE Times.
In a full teardown of the Playbook online, the group compares the new tablet to the iPad 2, the Samsung Galaxy Tab and the Motorola Xoom.
It remains to be seen how significant the Playbook design wins are. Early reviews panned the RIM tablet for its lack of the native email client that made the Blackberry wildly successful. The device also doesn't have access to the full suite of Android applications.
RIM said it will remedy the software shortcomings in a future software release. Reviewers said the omissions suggested the Playbook was rushed to market.
Below is an initial listing of components UBM TechInsights found in the Playbook:
SanDisk-Toshiba SDIN5C2-16G: 16 Gbytes MLC NAND flash memory
Elpida B8064B2BPB: One GByte LPDDR2 DRAM system memory located on the Omap 4430
Texas Instruments Omap 4430: Apps processor located in package-on-package
Texas Instruments TWL6040: Power management IC
Intersil i951 9HRTZ F032RG
Wolfson Micro WM8994E: Audio codec
ST Microelectronics XTV0987: 5 MPixel image processor, also found in the Blackberry Torch
Texas Instruments WL1283C: WiLink 7.0, a Wi-Fi, GPS, Bluetooth 4.0 and FM combo
Texas Instruments PS63020: High efficiency single inductor buck-boost converter with 4-A switches
Invensense MPU-3050: Triple-axis MEMS Gyroscope
Cypress CY8CTMA3: Touch screen controller
Bosch BMA150: Digital accelerometer
Texas Instruments LMV339: General-purpose low-voltage comparator
Intersil ISL9519: Narrow VDC regulator/charger with SMBus interface
Playbook主板背面
所用的3/4的TI芯片位于主板前面。TI和Invensense的芯片共同占据主板背面大片江山。
